ZHCSDZ5C August   2014  – November 2014

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Overvoltage-Protection (OVP) - Continuously Monitored
      2. 8.3.2  CHG Pin Indication (bq25101, bq25101H)
      3. 8.3.3  CHG Pin LED Pull-up Source (bq25101, bq25101H)
      4. 8.3.4  IN-DPM (VIN-DPM or IN-DPM)
      5. 8.3.5  OUT
      6. 8.3.6  ISET
      7. 8.3.7  PRE_TERM - Pre-Charge and Termination Programmable Threshold
      8. 8.3.8  TS
      9. 8.3.9  Timers
      10. 8.3.10 Termination
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down or Undervoltage Lockout (UVLO)
      2. 8.4.2 Power-up
      3. 8.4.3 Sleep Mode
      4. 8.4.4 New Charge Cycle
      5. 8.4.5 Termination and Timer Disable Mode (TTDM) - TS Pin High
      6. 8.4.6 Battery Detect Routine
      7. 8.4.7 Refresh Threshold
      8. 8.4.8 Starting a Charge on a Full Battery
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Charger Application Design Example
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Calculations
          1. 9.2.2.1.1 Program the Fast Charge Current, ISET:
          2. 9.2.2.1.2 Program the Termination Current Threshold, ITERM:
          3. 9.2.2.1.3 TS Function
          4. 9.2.2.1.4 Selecting IN and OUT Pin Capacitors
      3. 9.2.3 bq25100 Application Performance Plots
  10. 10Power Supply Recommendations
    1. 10.1 Leakage Current Effects on Battery Capacity
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Package
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 相关链接
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。