ZHCSF38G March   2016  – May 2018 AM5716 , AM5718

PRODUCTION DATA.  

  1. 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 修订历史记录
  3. Device Comparison
    1. 3.1 Device Comparison Table
  4. Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Ports (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.4.5  External Memory Interface (EMIF)
      6. 4.4.6  General-Purpose Memory Controller (GPMC)
      7. 4.4.7  Timers
      8. 4.4.8  Inter-Integrated Circuit Interface (I2C)
      9. 4.4.9  HDQ / 1-Wire Interface (HDQ1W)
      10. 4.4.10 Universal Asynchronous Receiver Transmitter (UART)
      11. 4.4.11 Multichannel Serial Peripheral Interface (McSPI)
      12. 4.4.12 Quad Serial Peripheral Interface (QSPI)
      13. 4.4.13 Multichannel Audio Serial Port (McASP)
      14. 4.4.14 Universal Serial Bus (USB)
      15. 4.4.15 SATA
      16. 4.4.16 Peripheral Component Interconnect Express (PCIe)
      17. 4.4.17 Controller Area Network Interface (DCAN)
      18. 4.4.18 Ethernet Interface (GMAC_SW)
      19. 4.4.19 Media Local Bus (MLB) Interface
      20. 4.4.20 eMMC/SD/SDIO
      21. 4.4.21 General-Purpose Interface (GPIO)
      22. 4.4.22 Keyboard controller (KBD)
      23. 4.4.23 Pulse Width Modulation (PWM) Interface
      24. 4.4.24 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      25. 4.4.25 Test Interfaces
      26. 4.4.26 System and Miscellaneous
        1. 4.4.26.1 Sysboot
        2. 4.4.26.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.26.3 Real-Time Clock (RTC) Interface
        4. 4.4.26.4 System Direct Memory Access (SDMA)
        5. 4.4.26.5 Interrupt Controllers (INTC)
        6. 4.4.26.6 Observability
      27. 4.4.27 Power Supplies
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power on Hours (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  LVCMOS CSI2 DC Electrical Characteristics
      8. 5.7.8  BMLB18 Buffers DC Electrical Characteristics
      9. 5.7.9  BC1833IHHV Buffers DC Electrical Characteristics
      10. 5.7.10 USBPHY DC Electrical Characteristics
      11. 5.7.11 Dual Voltage SDIO1833 DC Electrical Characteristics
      12. 5.7.12 Dual Voltage LVCMOS DC Electrical Characteristics
      13. 5.7.13 SATAPHY DC Electrical Characteristics
      14. 5.7.14 SERDES DC Electrical Characteristics
    8. 5.8 Thermal Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
        3. 6.1.4.3 RC On-die Oscillator Clock
    2. 6.2 DPLLs, DLLs Specifications
      1. 6.2.1 DPLL Characteristics
      2. 6.2.2 DLL Characteristics
  7. Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem - Video Output Ports
    8. 7.8  Display Subsystem - High-Definition Multimedia Interface (HDMI)
    9. 7.9  Camera Serial Interface 2 CAL bridge (CSI2)
      1. 7.9.1 CSI-2 MIPI D-PHY
    10. 7.10 External Memory Interface (EMIF)
    11. 7.11 General-Purpose Memory Controller (GPMC)
      1. 7.11.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.11.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.11.3 GPMC/NAND Flash Interface Asynchronous Timing
    12. 7.12 Timers
    13. 7.13 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-33 Timing Requirements for I2C Input Timings
      2. Table 7-34 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
      3. Table 7-35 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    14. 7.14 HDQ / 1-Wire Interface (HDQ1W)
      1. 7.14.1 HDQ / 1-Wire - HDQ Mode
      2. 7.14.2 HDQ/1-Wire-1-Wire Mode
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-40 Timing Requirements for UART
      2. Table 7-41 Switching Characteristics Over Recommended Operating Conditions for UART
    16. 7.16 Multichannel Serial Peripheral Interface (McSPI)
    17. 7.17 Quad Serial Peripheral Interface (QSPI)
    18. 7.18 Multichannel Audio Serial Port (McASP)
      1. Table 7-48 Timing Requirements for McASP1
      2. Table 7-49 Timing Requirements for McASP2
      3. Table 7-50 Timing Requirements for McASP3/4/5/6/7/8
    19. 7.19 Universal Serial Bus (USB)
      1. 7.19.1 USB1 DRD PHY
      2. 7.19.2 USB2 PHY
    20. 7.20 Serial Advanced Technology Attachment (SATA)
    21. 7.21 Peripheral Component Interconnect Express (PCIe)
    22. 7.22 Controller Area Network Interface (DCAN)
      1. Table 7-65 Timing Requirements for DCANx Receive
      2. Table 7-66 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
    23. 7.23 Ethernet Interface (GMAC_SW)
      1. 7.23.1 GMAC MII Timings
        1. Table 7-67 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-68 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-69 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-70 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.23.2 GMAC MDIO Interface Timings
      3. 7.23.3 GMAC RMII Timings
        1. Table 7-75 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-76 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-77 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-78 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.23.4 GMAC RGMII Timings
        1. Table 7-82 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-83 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-84 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-85 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    24. 7.24 eMMC/SD/SDIO
      1. 7.24.1 MMC1-SD Card Interface
        1. 7.24.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.24.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.24.1.3 SDR12, 4-bit data, half-cycle
        4. 7.24.1.4 SDR25, 4-bit data, half-cycle
        5. 7.24.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.24.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.24.1.7 UHS-I DDR50, 4-bit data
      2. 7.24.2 MMC2 - eMMC
        1. 7.24.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.24.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.24.2.3 High-speed HS200 JEDS84, 8-bit data, half cycle
        4. 7.24.2.4 High-speed JC64 DDR, 8-bit data
          1. Table 7-110 Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
      3. 7.24.3 MMC3 and MMC4-SDIO/SD
        1. 7.24.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.24.3.2 MMC3 and MMC4, SD High Speed
        3. 7.24.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.24.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.24.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    25. 7.25 General-Purpose Interface (GPIO)
    26. 7.26 PRU-ICSS Interfaces
      1. 7.26.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. 7.26.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
          1. Table 7-132 PRU-ICSS PRU Timing Requirements - Direct Input Mode
          2. Table 7-133 PRU-ICSS PRU Switching Requirements - Direct Output Mode
        2. 7.26.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
          1. Table 7-134 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
        3. 7.26.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
          1. Table 7-135 PRU-ICSS PRU Timing Requirements - Shift In Mode
          2. Table 7-136 PRU-ICSS PRU Switching Requirements - Shift Out Mode
        4. 7.26.1.4 PRU-ICSS PRU Sigma Delta and EnDAT Modes
          1. Table 7-137 PRU-ICSS PRU Timing Requirements - Sigma Delta Mode
          2. Table 7-138 PRU-ICSS PRU Timing Requirements - EnDAT Mode
          3. Table 7-139 PRU-ICSS PRU Switching Requirements - EnDAT Mode
      2. 7.26.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
        1. 7.26.2.1 PRU-ICSS ECAT Electrical Data and Timing
          1. Table 7-140 PRU-ICSS ECAT Timing Requirements - Input Validated With LATCH_IN
          2. Table 7-141 PRU-ICSS ECAT Timing Requirements - Input Validated With SYNCx
          3. Table 7-142 PRU-ICSS ECAT Timing Requirements - Input Validated With Start of Frame (SOF)
          4. Table 7-143 PRU-ICSS ECAT Timing Requirements - LATCHx_IN
          5. Table 7-144 PRU-ICSS ECAT Switching Requirements - Digital IOs
      3. 7.26.3 PRU-ICSS MII_RT and Switch
        1. 7.26.3.1 PRU-ICSS MDIO Electrical Data and Timing
          1. Table 7-145 PRU-ICSS MDIO Timing Requirements - MDIO_DATA
          2. Table 7-146 PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
          3. Table 7-147 PRU-ICSS MDIO Switching Characteristics - MDIO_DATA
        2. 7.26.3.2 PRU-ICSS MII_RT Electrical Data and Timing
          1. Table 7-148 PRU-ICSS MII_RT Timing Requirements - MII[x]_RXCLK
          2. Table 7-149 PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
          3. Table 7-150 PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
          4. Table 7-151 PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
      4. 7.26.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
        1. Table 7-152 Timing Requirements for PRU-ICSS UART Receive
        2. Table 7-153 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
      5. 7.26.5 PRU-ICSS Manual Functional Mapping
    27. 7.27 System and Miscellaneous interfaces
    28. 7.28 Test Interfaces
      1. 7.28.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.28.1.1 JTAG Electrical Data/Timing
          1. Table 7-173 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-174 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-175 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-176 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.28.2 Trace Port Interface Unit (TPIU)
        1. 7.28.2.1 TPIU PLL DDR Mode
  8. Applications, Implementation, and Layout
    1. 8.1 Power Supply Mapping
    2. 8.2 DDR3 Board Design and Layout Guidelines
      1. 8.2.1 DDR3 General Board Layout Guidelines
      2. 8.2.2 DDR3 Board Design and Layout Guidelines
        1. 8.2.2.1  Board Designs
        2. 8.2.2.2  DDR3 EMIF
        3. 8.2.2.3  DDR3 Device Combinations
        4. 8.2.2.4  DDR3 Interface Schematic
          1. 8.2.2.4.1 32-Bit DDR3 Interface
          2. 8.2.2.4.2 16-Bit DDR3 Interface
        5. 8.2.2.5  Compatible JEDEC DDR3 Devices
        6. 8.2.2.6  PCB Stackup
        7. 8.2.2.7  Placement
        8. 8.2.2.8  DDR3 Keepout Region
        9. 8.2.2.9  Bulk Bypass Capacitors
        10. 8.2.2.10 High-Speed Bypass Capacitors
          1. 8.2.2.10.1 Return Current Bypass Capacitors
        11. 8.2.2.11 Net Classes
        12. 8.2.2.12 DDR3 Signal Termination
        13. 8.2.2.13 VREF_DDR Routing
        14. 8.2.2.14 VTT
        15. 8.2.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.2.2.15.1 Four DDR3 Devices
            1. 8.2.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.2.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.2.2.15.2 Two DDR3 Devices
            1. 8.2.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.2.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.2.2.15.3 One DDR3 Device
            1. 8.2.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.2.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.2.2.16 Data Topologies and Routing Definition
          1. 8.2.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.2.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.2.2.17 Routing Specification
          1. 8.2.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.2.2.17.2 DQS and DQ Routing Specification
    3. 8.3 High Speed Differential Signal Routing Guidance
    4. 8.4 Power Distribution Network Implementation Guidance
    5. 8.5 Thermal Solution Guidance
    6. 8.6 Single-Ended Interfaces
      1. 8.6.1 General Routing Guidelines
      2. 8.6.2 QSPI Board Design and Layout Guidelines
    7. 8.7 LJCB_REFN/P Connections
    8. 8.8 Clock Routing Guidelines
      1. 8.8.1 32-kHz Oscillator Routing
      2. 8.8.2 Oscillator Ground Connection
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 Related Links
    6. 9.6 Community Resources
    7. 9.7 Trademarks
    8. 9.8 静电放电警告
    9. 9.9 术语表
  10. 10Mechanical Packaging and Orderable Information
    1. 10.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

External Memory Interface (EMIF)

NOTE

For more information, see the Memory Subsystem / EMIF Controller section of the device TRM.

NOTE

Dual rank support is not available on this device, but signal names are retained for consistency with the AM57xx family of devices.

NOTE

The index number 1 which is part of the EMIF1 signal prefixes (ddr1_*) listed in Table 4-8, EMIF Signal Descriptions, not to be confused with DDR1 type of SDRAM memories.

Table 4-8 EMIF Signal Descriptions

SIGNAL NAME DESCRIPTION TYPE BALL
ddr1_csn0 EMIF1 Chip Select 0 O AH23
ddr1_csn1 EMIF1 Chip Select 1 O AB16
ddr1_cke EMIF1 Clock Enable O AG22
ddr1_ck EMIF1 Clock O AG24
ddr1_nck EMIF1 Negative Clock O AH24
ddr1_odt0 EMIF1 On-Die Termination for Chip Select 0 O AE20
ddr1_odt1 EMIF1 On-Die Termination for Chip Select 1 O AC17
ddr1_casn EMIF1 Column Address Strobe O AC18
ddr1_rasn EMIF1 Row Address Strobe O AF20
ddr1_wen EMIF1 Write Enable O AH21
ddr1_rst EMIF1 Reset output (DDR3-SDRAM only) O AG21
ddr1_ba0 EMIF1 Bank Address O AF17
ddr1_ba1 EMIF1 Bank Address O AE18
ddr1_ba2 EMIF1 Bank Address O AB18
ddr1_a0 EMIF1 Address Bus O AD20
ddr1_a1 EMIF1 Address Bus O AC19
ddr1_a2 EMIF1 Address Bus O AC20
ddr1_a3 EMIF1 Address Bus O AB19
ddr1_a4 EMIF1 Address Bus O AF21
ddr1_a5 EMIF1 Address Bus O AH22
ddr1_a6 EMIF1 Address Bus O AG23
ddr1_a7 EMIF1 Address Bus O AE21
ddr1_a8 EMIF1 Address Bus O AF22
ddr1_a9 EMIF1 Address Bus O AE22
ddr1_a10 EMIF1 Address Bus O AD21
ddr1_a11 EMIF1 Address Bus O AD22
ddr1_a12 EMIF1 Address Bus O AC21
ddr1_a13 EMIF1 Address Bus O AF18
ddr1_a14 EMIF1 Address Bus O AE17
ddr1_a15 EMIF1 Address Bus O AD18
ddr1_d0 EMIF1 Data Bus IO AF25
ddr1_d1 EMIF1 Data Bus IO AF26
ddr1_d2 EMIF1 Data Bus IO AG26
ddr1_d3 EMIF1 Data Bus IO AH26
ddr1_d4 EMIF1 Data Bus IO AF24
ddr1_d5 EMIF1 Data Bus IO AE24
ddr1_d6 EMIF1 Data Bus IO AF23
ddr1_d7 EMIF1 Data Bus IO AE23
ddr1_d8 EMIF1 Data Bus IO AC23
ddr1_d9 EMIF1 Data Bus IO AF27
ddr1_d10 EMIF1 Data Bus IO AG27
ddr1_d11 EMIF1 Data Bus IO AF28
ddr1_d12 EMIF1 Data Bus IO AE26
ddr1_d13 EMIF1 Data Bus IO AC25
ddr1_d14 EMIF1 Data Bus IO AC24
ddr1_d15 EMIF1 Data Bus IO AD25
ddr1_d16 EMIF1 Data Bus IO V20
ddr1_d17 EMIF1 Data Bus IO W20
ddr1_d18 EMIF1 Data Bus IO AB28
ddr1_d19 EMIF1 Data Bus IO AC28
ddr1_d20 EMIF1 Data Bus IO AC27
ddr1_d21 EMIF1 Data Bus IO Y19
ddr1_d22 EMIF1 Data Bus IO AB27
ddr1_d23 EMIF1 Data Bus IO Y20
ddr1_d24 EMIF1 Data Bus IO AA23
ddr1_d25 EMIF1 Data Bus IO Y22
ddr1_d26 EMIF1 Data Bus IO Y23
ddr1_d27 EMIF1 Data Bus IO AA24
ddr1_d28 EMIF1 Data Bus IO Y24
ddr1_d29 EMIF1 Data Bus IO AA26
ddr1_d30 EMIF1 Data Bus IO AA25
ddr1_d31 EMIF1 Data Bus IO AA28
ddr1_ecc_d0 EMIF1 ECC Data Bus IO W22
ddr1_ecc_d1 EMIF1 ECC Data Bus IO V23
ddr1_ecc_d2 EMIF1 ECC Data Bus IO W19
ddr1_ecc_d3 EMIF1 ECC Data Bus IO W23
ddr1_ecc_d4 EMIF1 ECC Data Bus IO Y25
ddr1_ecc_d5 EMIF1 ECC Data Bus IO V24
ddr1_ecc_d6 EMIF1 ECC Data Bus IO V25
ddr1_ecc_d7 EMIF1 ECC Data Bus IO Y26
ddr1_dqm0 EMIF1 Data Mask O AD23
ddr1_dqm1 EMIF1 Data Mask O AB23
ddr1_dqm2 EMIF1 Data Mask O AC26
ddr1_dqm3 EMIF1 Data Mask O AA27
ddr1_dqm_ecc EMIF1 ECC Data Mask O V26
ddr1_dqs0 Data strobe 0 input/output for byte 0 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO AH25
ddr1_dqsn0 Data strobe 0 invert IO AG25
ddr1_dqs1 Data strobe 1 input/output for byte 1 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO AE27
ddr1_dqsn1 Data strobe 1 invert IO AE28
ddr1_dqs2 Data strobe 2 input/output for byte 2 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO AD27
ddr1_dqsn2 Data strobe 2 invert IO AD28
ddr1_dqs3 Data strobe 3 input/output for byte 3 of the 32-bit data bus. This signal is output to the EMIF1 memory when writing and input when reading. IO Y28
ddr1_dqsn3 Data strobe 3 invert IO Y27
ddr1_dqs_ecc EMIF1 ECC Data strobe input/output. This signal is output to the EMIF1 memory when writing and input when reading. IO V27
ddr1_dqsn_ecc EMIF1 ECC Complementary Data strobe IO V28
ddr1_vref0 Reference Power Supply EMIF1 A Y18