ZHCSE48B September   2015  – January 2019 ADC31JB68

PRODUCTION DATA.  

  1. 特性
    1. 18 英寸、5 密耳输出端的传输眼图。5Gb/s、带优化型去加重功能的 FR4 微带迹线
  2. 应用
  3. 说明
    1.     –1dBFS、450MHz 输入时的频谱
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Converter Performance
    6. 6.6 Electrical Characteristics: Power Supply
    7. 6.7 Electrical Characteristics: Interface
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Interface Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs and Input Buffer
      2. 8.3.2  Amplitude and Phase Imbalance Correction
      3. 8.3.3  Over-Range Detection
      4. 8.3.4  Input Clock Divider
      5. 8.3.5  SYSREF Detection Gate
      6. 8.3.6  Serial Differential Output Drivers
        1. 8.3.6.1 De-Emphasis Equalization
        2. 8.3.6.2 Serial Lane Inversion
      7. 8.3.7  ADC Core Calibration
      8. 8.3.8  Data Format
      9. 8.3.9  JESD204B Supported Features
      10. 8.3.10 JESD204B Interface
      11. 8.3.11 Transport Layer Configuration
        1. 8.3.11.1 Lane Configuration
        2. 8.3.11.2 Frame Format
        3. 8.3.11.3 ILA Information
      12. 8.3.12 Test Pattern Sequences
      13. 8.3.13 JESD204B Link Initialization
        1. 8.3.13.1 Frame Alignment
        2. 8.3.13.2 Code Group Synchronization
      14. 8.3.14 SPI
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down and Sleep Modes
    5. 8.5 Register Map
      1. 8.5.1 Register Descriptions
        1. 8.5.1.1  CONFIG_A (address = 0x0000) [reset = 0x3C]
          1. Table 6. CONFIG_A
        2. 8.5.1.2  DEVICE CONFIG (address = 0x0002) [reset = 0x00]
          1. Table 7. DEVICE CONFIG
        3. 8.5.1.3  CHIP_TYPE (address = 0x0003 ) [reset = 0x03]
          1. Table 8. CHIP_TYPE
        4. 8.5.1.4  CHIP_ID (address = 0x0005, 0x0004) [reset = 0x00, 0x1B]
          1. Table 9. CHIP_ID
        5. 8.5.1.5  CHIP_VERSION (address =0x0006) [reset = 0x00]
          1. Table 10. CHIP_VERSION
        6. 8.5.1.6  VENDOR_ID (address = 0x000D, 0x000C) [reset = 0x04, 0x51]
          1. Table 11. VENDOR_ID
        7. 8.5.1.7  SPI_CFG (address = 0x0010 ) [reset = 0x01]
          1. Table 12. SPI_CFG
        8. 8.5.1.8  OM1 (Operational Mode 1) (address = 0x0012) [reset = 0xC1]
          1. Table 13. OM1 (Operational Mode 1)
        9. 8.5.1.9  OM2 (Operational Mode 2) (address = 0x0013) [reset = 0x20]
          1. Table 14. OM2 (Operational Mode 2)
        10. 8.5.1.10 IMB_ADJ (Imbalance Adjust) (address = 0x0014) [reset = 0x00]
          1. Table 15. IMB_ADJ (Imbalance Adjust)
        11. 8.5.1.11 OVR_EN (Over-Range Enable) (address = 0x003A) [reset = 0x00]
          1. Table 16. OVR_EN (Over-Range Enable)
        12. 8.5.1.12 OVR_HOLD (Over-Range Hold) (address = 0x003B) [reset = 0x00]
          1. Table 17. OVR_HOLD (Over-Range Hold)
        13. 8.5.1.13 OVR_TH (Over-Range Threshold) (address = 0x003C) [reset = 0x00]
          1. Table 18. OVR_TH (Over-Range Threshold)
        14. 8.5.1.14 DC_MODE (DC Offset Correction Mode) (address = 0x003D) [reset = 0x00]
          1. Table 19. DC_MODE (DC Offset Correction Mode)
        15. 8.5.1.15 SER_CFG (Serial Lane Transmitter Configuration) (address = 0x0047) [reset = 0x00]
          1. Table 20. SER_CFG (Serial Lane Transmitter Configuration)
        16. 8.5.1.16 JESD_CTRL1 (JESD Configuration Control 1) (address = 0x0060) [reset = 0x7F]
          1. Table 21. JESD_CTRL1 (JESD Configuration Control 1)
        17. 8.5.1.17 JESD_CTRL2 (JESD Configuration Control 2) (address = 0x0061) [reset = 0x00]
          1. Table 22. JESD_CTRL2 (JESD Configuration Control 2)
        18. 8.5.1.18 JESD_RSTEP (JESD Ramp Pattern Step) (address = 0x0063, 0x0062) [reset = 0x00, 0x01]
          1. Table 23. JESD_RSTEP (JESD Ramp Pattern Step)
        19. 8.5.1.19 SER_INV (Serial Lane Inversion Control) (address = 0x0064) [reset = 0x00]
          1. Table 24. SER_INV (Serial Lane Inversion Control)
        20. 8.5.1.20 JESD_STATUS (JESD Link Status) (address = 0x006C) [reset = N/A]
          1. Table 25. JESD_STATUS (JESD Link Status)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Optimizing Converter Performance
        1. 9.1.1.1 Internal Noise Sources
        2. 9.1.1.2 External Noise Sources
      2. 9.1.2 Analog Input Considerations
        1. 9.1.2.1 Differential Analog Inputs and Full Scale Range
        2. 9.1.2.2 Analog Input Network Model
        3. 9.1.2.3 Input Bandwidth
        4. 9.1.2.4 Driving the Analog Input
        5. 9.1.2.5 Clipping and Over-Range
      3. 9.1.3 CLKIN, SYSREF, and SYNCb Input Considerations
        1. 9.1.3.1 Driving the CLKIN+ and CLKIN– Input
        2. 9.1.3.2 Driving the SYSREF Input
        3. 9.1.3.3 SYSREF Signaling
        4. 9.1.3.4 SYSREF Timing
        5. 9.1.3.5 Effectively Using the Detection Gate Feature
        6. 9.1.3.6 Driving the SYNCb Input
      4. 9.1.4 Output Serial Interface Considerations
        1. 9.1.4.1 Output Serial-Lane Interface
        2. 9.1.4.2 Voltage Swing and De-Emphasis Optimization
        3. 9.1.4.3 Minimizing EMI
      5. 9.1.5 JESD204B System Considerations
        1. 9.1.5.1 Frame and LMFC Clock Alignment Procedure
        2. 9.1.5.2 Link Interruption
        3. 9.1.5.3 Clock Configuration Examples
      6. 9.1.6 SPI
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Design
    2. 10.2 Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关文档 
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Timing Requirements

typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 500 MSPS, 50% clock duty cycle, VA3.0 = 3 V; VA1.8 = 1.8 V; VA1.2 = VACLK1.2 = 1.2 V; –1 dBFS differential input, and R(term) = 100 Ω (unless otherwise noted) (see Figure 1 and Figure 2 for timing diagrams)
PARAMETER NOTES MIN NOM MAX UNIT
ADC SAMPLING INSTANT TIMING CHARACTERISTICS
FS Sampling rate Equal to FCLKIN / CLKDIV 100 500 MSPS
FCLKIN Input clock frequency at CLKIN inputs CLKDIV = 1 100 500 MHz
CLKDIV = 2 200 1000
CLKDIV = 4 400 2000
DC Input clock (CLKIN) duty cycle CLKDIV = 1 50% ± 20%
CLKDIV = 2 or CLKDIV = 4 50% ± 5%
tLAT-ADC ADC core latency Delay from a reference sampling instant to the boundary of the internal LMFC where the reference sample is the first sample of the next transmitted multi-frame. In this device, the frame clock period is equal to the sampling clock period. 7 Frame clock cycles
tJ Additive sampling aperture jitter Depends on input CLKIN differential edge rate at the zero crossing, dVSS/dt, tested with 5 V/ns edge rate. fs
CLKDIV = 1 80
CLKDIV = 2, 4 90
OVER-RANGE INTERFACE TIMING CHARACTERISTICS (SDO/OVR(1))
tODH OVR assertion delay Functional delay between an overrange value sampled and OVR asserted 8 Frame clock cycles
tODL OVR de-assertion delay Functional delay between first underrange value sampled until OVR de-assertion, configurable via SPI Frame clock cycles
Configured for minimum delay tODH
Configured for maximum delay tODH + 15
SYSREF TIMING CHARACTERISTICS
tPH-SYS SYSREF assertion duration Required duration of SYSREF assertion after rising edge event 2 Frame clock cycles
tPL-SYS SYSREF de-assertion duration Required duration of SYSREF de-assertion after falling edge event 2 Frame clock cycles
tS-SYS SYSREF setup time Relative to CLKIN rising edge 350 ps
tH-SYS SYSREF hold time Relative to CLKIN rising edge 0 ps
JESD204B INTERFACE LINK TIMING CHARACTERISTICS
tD-LMFC SYSREF to LMFC delay Functional delay between SYSREF assertion latched and LMFC frame boundary. Depends on CLKDIV setting
CLKDIV = 1 4 CLKIN cycles
4 Frame clock cycles
CLKDIV = 2 10 CLKIN cycles
5 Frame clock cycles
CLKDIV = 4 18 CLKIN cycles
4.5 Frame clock cycles
tD-K28 LMFC to K28.5 delay Functional delay between the start of the first K28.5 frame during code group synchronization at the serial output and the preceding LMFC frame boundary 5.6 6.6 7.6 Frame clock cycles
tD-ILA LMFC to ILA delay Functional delay between the start of the first ILA frame during initial lane synchronization at the serial output and the preceding LMFC frame boundary 5.6 6.6 7.6
tD-DATA LMFC to valid data delay Functional delay between the start of the first valid data frame at the serial output and the preceding LMFC frame boundary 5.6 6.6 7.6
tS-SYNCb-F SYNCb setup time Required SYNCb setup time-relative to the internal LMFC boundary(2) 3 Frame clock cycles
tH-SYNCb-F SYNCb hold time Required SYNCb hold time relative to the internal LMFC boundary(2) 0
tH-SYNCb SYNCb assertion hold time Required SYNCb hold time after assertion before de-assertion to initiate a link resynchronization 4
tILA ILA duration Duration of the ILA sequence 4 Multi-frame
clock cycles
SERIAL OUTPUT DATA TIMING CHARACTERISTICS
FSR Serial bit rate 1 5.0 Gb/s
UI Unit interval 5.0 Gb/s data rate 200 ps
tR, tF Rise/fall times 5.0 Gb/s data rate, default values for VOD and DEM 43 ps
DJ Deterministic jitter Includes periodic jitter (PJ), data dependent jitter (DDJ), duty cycle distortion (DCD), and inter-symbol interference (ISI); 5.0 Gb/s data rate 0.049 p-p UI
9.82 p-p ps
RJ Random jitter Assumes BER of 1e-15 (Q = 15.88); 5.0 Gb/s data rate 0.119 p-p UI
1.50 rms ps
TJ Total jitter Sum of DJ and RJ, assumes BER of 1e-15 (Q = 15.88); 5.0 Gb/s data rate 0.169 p-p UI
33.6 p-p ps
SPI BUS TIMING CHARACTERISTICS(3)
ƒSCLK Serial clock frequency fSCLK = 1 / tP 20 MHz
tPH SCLK pulse width – high 6 ns
tPL SCLK pulse width – low 7 ns
tSSU SDI input data setup time 3 ns
tSH SDI input data hold time 1 ns
tODZ SDO output data driven-to-3-state time 10 ns
tOZD SDO output data 3-state-to-driven time 25 ns
tOD SDO output data delay time 25 ns
tCSS CSB setup time 3 ns
tCSH CSB hold time 1 ns
tIAG Inter-access gap Minimum time CSB must be de-asserted between accesses 1 ns
The SDO/OVR pin is configured in over-range output mode.
The SYNCb setup and hold times determine the multi-frame after which the ILA is initiated but meeting the setup and hold times are not required to achieve deterministic latency.
All timing specifications for the SPI given for VSPI = 1.8-V logic levels and a 5-pF capacitive load on the SDO pin. Timing specification require larger margins for VSPI= 1.2 V. The serial bit rate of the SPI should be limited to 10 Mb/s or lower for VSPI = 1.2-V logic.
ADC31JB68 Sampling_Timing_Diagram.gifFigure 1. Sample Timing Diagram
ADC31JB68 OVR_Timing.gifFigure 2. Overrange (OVR) Timing Diagram
ADC31JB68 SPI_Timing_Diagram.gifFigure 3. SPI Timing Diagram