SBAS650C May   2014  – April 2021 AFE4403

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Family Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Requirements: Supply Ramp and Power-Down
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Receiver Channel
        1. 8.3.1.1 Receiver Front-End
        2. 8.3.1.2 Ambient Cancellation Scheme and Second Stage Gain Block
        3. 8.3.1.3 Receiver Control Signals
        4. 8.3.1.4 Receiver Timing
      2. 8.3.2 Clocking and Timing Signal Generation
      3. 8.3.3 Timer Module
        1. 8.3.3.1 Using the Timer Module
      4. 8.3.4 Receiver Subsystem Power Path
      5. 8.3.5 Transmit Section
        1. 8.3.5.1 Third LED Support
        2. 8.3.5.2 Transmitter Power Path
        3. 8.3.5.3 LED Power Reduction During Periods of Inactivity
        4. 8.3.5.4 LED Configurations
    4. 8.4 Device Functional Modes
      1. 8.4.1 ADC Operation and Averaging Module
        1. 8.4.1.1 Operation Without Averaging
        2. 8.4.1.2 Operation With Averaging
        3. 8.4.1.3 Dynamic Power-Down Mode
      2. 8.4.2 Diagnostics
        1. 8.4.2.1 Photodiode-Side Fault Detection
        2. 8.4.2.2 Transmitter-Side Fault Detection
        3. 8.4.2.3 Diagnostics Module
    5. 8.5 Programming
      1. 8.5.1 Serial Programming Interface
      2. 8.5.2 Reading and Writing Data
        1. 8.5.2.1 Writing Data
        2. 8.5.2.2 Reading Data
        3. 8.5.2.3 Multiple Data Reads and Writes
        4. 8.5.2.4 Register Initialization
        5. 8.5.2.5 AFE SPI Interface Design Considerations
    6. 8.6 Register Maps
      1. 8.6.1 AFE Register Map
      2. 8.6.2 AFE Register Description
  9. Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Consumption Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Fully-Integrated AFE for Pulse Oximeter and Heart Rate Monitoring Applications:
  • Transmit:
    • Integrated Dual LED Driver
      (H-Bridge or Common Anode)
    • Option for a Third LED Support for Optimized SPO2, HRM, or Multi-Wavelength HRM
    • Up to 110-dB Dynamic Range
    • LED Current:
      • Programmable to 100 mA with 8-Bit Current Resolution
    • 30 µA + Average LED Current
    • Programmable LED On-Time
    • Independent LED2 and LED1 Current Reference
  • Receive Channel with High Dynamic Range:
    • 22-Bit Output in Twos Complement Format
    • Up to 105-dB Dynamic Range
    • Low Power: < 650 µA
    • Dynamic Power-Down Mode to Reduce Current to 300 µA
    • Adaptable to a Very Wide Range of Signal Amplitudes:
      • Total Programmable Gain: 10 kΩ to 4 MΩ
    • Integrated Digital Ambient Estimation and Subtraction
  • Flexible Clocking by External Clock or Crystal:
    • Pulse Frequency: 62.5 SPS to 2000 SPS
    • Flexible Pulse sequencing and Timing Control
    • Input Clock Range: 4 MHz (Min) to 60 MHz (Max)
  • Integrated Fault Diagnostics:
    • Photodiode and LED Open and
      Short Detection
  • Supplies:
    • Rx = 2.0 V to 3.6 V
    • Tx = 3.0 V to 5.25 V
  • Package: Compact DSBGA-36
    (3.07 mm × 3.07 mm × 0.5 mm)
  • Specified Temperature Range: 0°C–20°C to 70°C